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1

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim,, Jun So Pak,, Jonghyun Cho,, Eakhwan Song,, Jeonghyeon Cho,, Heegon Kim,, Taigon Song,, Junho Lee,, Hyungdong Lee,, Kunwoo Park,, Seungtaek Yang,, Min-Suk Suh,, Kwang-Yoo Byun,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 3.00 MB

english, 2011

2

Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Kim, Jonghoon J., Kim, Heegon, Jung, Daniel H., Choi, Sumin, Lim, Jaemin, Kim, Youngwoo, Park, Junyong, Kim, Hyesoo, Ha, Dongho, Bae, Michael, Kim, Joungho

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2017

Language:

english

File:

PDF, 2.75 MB

english, 2017

3

[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Design and analysis of silicone rubber-based TERAPOSER for LPDDR4 memory test

Kim, Jonghoon J., Kim, Heegon, Jung, Daniel H., Choi, Sumin, Jaemin,, Park, Junyong, Kim, Jiseong, Kim, Joungho, Ha, Dongho, Bae, Michael

Year:

2016

Language:

english

File:

PDF, 709 KB

english, 2016

4

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects

Choi, Sumin, Kim, Heegon, Kim, Kiyeong, Park, Junyong, Jung, Daniel H., Kim, Joungho

Year:

2017

Language:

english

File:

PDF, 1.06 MB

english, 2017

5

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Estimation and analysis of crosstalk effects in high-bandwidth memory channel

Choi, Sumin, Kim, Heegon, Park, Junyong, Kim, Dong-Hyun, Jung, Daniel H., Lim, Jaemin, Cho, Kyungjun, Kim, Joungho

Year:

2018

Language:

english

File:

PDF, 229 KB

english, 2018

6

Measurement and Analysis of a High-Speed TSV Channel

Kim, Heegon, Cho, Jonghyun, Kim, Myunghoi, Kim, Kiyeong, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Choi, Kwangseong, Bae, Hyun-Cheol, Kim, Joungho, Kim, Jiseong

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 2.36 MB

english, 2012

7

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Kim, Kiyeong, Hwang, Chulsoon, Koo, Kyoungchoul, Cho, Jonghyun, Kim, Heegon, Kim, Joungho, Lee, Junho, Lee, Hyung-Dong, Park, Kun-Woo, Pak, Jun So

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 2.51 MB

english, 2012

8

[IEEE 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Nara, Japan (2013.12.15-2013.12.18)] 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling

Kim, Heegon, Cho, Jonghyun, Jung, Daniel H., Kim, Jonghoon J., Choi, Sumin, Kim, Joungho, Lee, Junho, Park, Kunwoo

Year:

2013

Language:

english

File:

PDF, 1.81 MB

english, 2013

9

[IEEE 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Nara, Japan (2013.12.15-2013.12.18)] 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling

Kim, Jonghoon J., Kim, Heegon, Kim, Sukjin, Bumhee Bae,, Jung, Daniel H., Sunkyu Kong,, Kim, Joungho, Junho Lee,, Kunwoo Park,

Year:

2013

Language:

english

File:

PDF, 395 KB

english, 2013

10

Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

Kim, Kiyeong, Yook, Jong Min, Kim, Junchul, Kim, Heegon, Lee, Junho, Park, Kunwoo, Kim, Joungho

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 2.45 MB

english, 2013

11

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

Heegon Kim,, Jonghyun Cho,, Joohee Kim,, Sumin Choi,, Kiyeong Kim,, Junho Lee,, Kunwoo Park,, Pak, Jun So, Joungho Kim,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 3.46 MB

english, 2015

12

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Non-contact wafer-level TSV connectivity test methodology using magnetic coupling

Kim, Jonghoon J., Kim, Heegon, Kim, Sukjin, Bae, Bumhee, Jung, Daniel H., Kong, Sunkyu, Kim, Joungho, Lee, Junho, Park, Kunwoo

Year:

2013

Language:

english

File:

PDF, 278 KB

english, 2013

13

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer

Lee, Hyunsuk, Kim, Heegon, Kim, Kiyeong, Jung, Daniel H., Kim, Jonghoon J., Choi, Sumin, Lim, Jaemin, Kim, Joungho, Kim, Hyungsoo, Park, Kunwoo

Year:

2014

Language:

english

File:

PDF, 1.00 MB

english, 2014

14

Enhanced Photodynamic Cancer Treatment by Mitochondria-Targeting and Brominated Near-Infrared Fluorophores

Noh, Ilkoo, Lee, DaeYong, Kim, Heegon, Jeong, Chan-Uk, Lee, Yunsoo, Ahn, Jung-Oh, Hyun, Hoon, Park, Ji-Ho, Kim, Yeu-Chun

Journal:

Advanced Science

Year:

2017

Language:

english

File:

PDF, 15.77 MB

english, 2017

15

Cyclodextrin polymer improves atherosclerosis therapy and reduces ototoxicity

Kim, Heegon, Han, Junhee, Park, Ji-Ho

Journal:

Journal of Controlled Release

Year:

2019

File:

PDF, 13.12 MB

2019

16

Affinity-Driven Design of Cargo-Switching Nanoparticles to Leverage a Cholesterol-Rich Microenvironment for Atherosclerosis Therapy

Kim, Heegon, Kumar, Sandeep, Kang, Dong-Won, Jo, Hanjoong, Park, Ji-Ho

Journal:

Year:

2020

File:

PDF, 1.31 MB

2020

17

Iron loss analysis of linear oscillating actuator for linear compressor

Wiak, S., Lee, Heon, Moon, Heegon, Wang, Semyung, Park, Kyungbae

Journal:

COMPEL Int J for Computation and Maths in Electrical and Electronic Eng

Year:

2006

Language:

english

File:

PDF, 167 KB

english, 2006

18

Clinical outcomes and prognostic factors of ipsilateral hip and femoral shaft fractures

Park, Heegon, Yoo, Jaesung, Ryu, Jeewon

Journal:

European Orthopaedics and Traumatology

Year:

2014

Language:

english

File:

PDF, 374 KB

english, 2014

19

[IEEE 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - Naples, Italy (2011.05.8-2011.05.11)] 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - Channel design for wide system bandwidth in a TSV based 3D IC

Kim, Heegon, Cho, Jonghyun, Kim, Joohee, Kim, Myunghoi, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Kim, Joungho, Pak, Jun So

Year:

2011

Language:

english

File:

PDF, 392 KB

english, 2011

20

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - Wafer-level TSV connectivity test using ring oscillator scheme

Pak, Jun So, Cho, Jonghyun, Kim, Joohee, Kim, Heegon, Kim, Kiyeong, Kim, Joungho, Lee, Junho, Park, Kunwoo

Year:

2012

Language:

english

File:

PDF, 593 KB

english, 2012

21

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Analytical model for predicting the electromagnetic fields intensity in wireless power transfer systems

Sunkyu Kong,, Chulsoon Hwang,, Kiyeong Kim,, Heegon Kim,, Laehyuk Park,, Unkyoo Park,, Jiseong Kim,, Joungho Kim,

Year:

2011

Language:

english

File:

PDF, 345 KB

english, 2011

22

[IEEE Propagation in Wireless Communications (ICEAA) - Torino, Italy (2011.09.12-2011.09.16)] 2011 International Conference on Electromagnetics in Advanced Applications - Signal and power integrity analysis of TSV-Based 3D IC

Pak, Jun So, Kim, Heegon, Cho, Jonghyun, Kim, Joohee, Kim, Kiyeong, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Kim, Joungho

Year:

2011

Language:

english

File:

PDF, 1.09 MB

english, 2011

23

[IEEE 2013 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Nara, Japan (2013.12.12-2013.12.15)] 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) - Design of crosstalk compensation passive equalizers for high-speed differential signaling on 2.5D-IC interposer

Choi, Sumin, Kim, Heegon, Kim, Sukjin, Jung, Daniel H., Kim, Joungho, Lee, Junho, Park, Kunwoo

Year:

2013

Language:

english

File:

PDF, 377 KB

english, 2013

24

[IEEE 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Hanzhou (2011.12.12-2011.12.14)] 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Impedance of power distribution networks in TSV-based 3D-ICs

Kiyeong Kim,, Jun So Pak,, Heegon Kim,, Junho Lee,, Kunwoo Park,, Joungho Kim,

Year:

2011

Language:

english

File:

PDF, 379 KB

english, 2011

25

[American Institute of Aeronautics and Astronautics 8th Symposium on Multidisciplinary Analysis and Optimization - Long Beach,CA,U.S.A. (06 September 2000 - 08 September 2000)] 8th Symposium on Multidisciplinary Analysis and Optimization - Topology optimization of optical pick-up actuator

Wang, Semyung, Moon, Heegon, Park, Kyihwan, Kim, Yongsu

Year:

2000

Language:

english

File:

PDF, 671 KB

english, 2000

26

Energy Efficient Image/Video Data Transmission on Commercial Multi-Core Processors

Lee, Sungju, Kim, Heegon, Chung, Yongwha, Park, Daihee

Journal:

Year:

2012

Language:

english

File:

PDF, 1.91 MB

english, 2012

27

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Eye-diagram simulation and analysis of a high-speed TSV-based channel

Kim, Heegon, Cho, Jonghyun, Kim, Jonghoon J., Jung, Daniel H., Choi, Sumin, Kim, Joungho, Lee, Junho, Park, Kunwoo

Year:

2013

Language:

english

File:

PDF, 1.05 MB

english, 2013

28

CPU-GPU hybrid computing for feature extraction from video stream

Lee, Sungju, Kim, Heegon, Park, Daihee, Chung, Yongwha, Jeong, Taikyeong

Journal:

IEICE Electronics Express

Year:

2014

Language:

english

File:

PDF, 1.74 MB

english, 2014

29

[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Eye diagram estimation of 8B/10B encoded high-speed serial link for signal integrity test using silicone rubber socket

Park, Junyong, Kim, Jonghoon J., Kim, Heegon, Kim, Joungho, Bae, Michael, Ha, Dongho

Year:

2016

File:

PDF, 401 KB

2016

30

Cooperative tumour cell membrane targeted phototherapy

Kim, Heegon, Lee, Junsung, Oh, Chanhee, Park, Ji-Ho

Journal:

Nature Communications

Year:

2017

Language:

english

File:

PDF, 1.46 MB

english, 2017

31

A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels

Park, Junyong, Choi, Sumin, Kim, Jonghoon J., Kim, Youngwoo, Lee, Manho, Kim, Heegon, Bae, Bumhee, Song, Huijin, Cho, Kyungjun, Lee, Seongsoo, Lee, Hyunsuk, Kim, Joungho

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2017

Language:

english

File:

PDF, 1.47 MB

english, 2017

32

Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

Cho, Kyungjun, Kim, Youngwoo, Lee, Hyunsuk, Kim, Heegon, Choi, Sumin, Song, Jinwook, Kim, Subin, Park, Junyong, Lee, Seongsoo, Kim, Joungho

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 5.15 MB

english, 2018

33

Cancer Treatment: Enhanced Photodynamic Cancer Treatment by Mitochondria-Targeting and Brominated Near-Infrared Fluorophores (Adv. Sci. 3/2018)

Noh, Ilkoo, Lee, DaeYong, Kim, Heegon, Jeong, Chan-Uk, Lee, Yunsoo, Ahn, Jung-Oh, Hyun, Hoon, Park, Ji-Ho, Kim, Yeu-Chun

Journal:

Advanced Science

Year:

2018

File:

PDF, 3.49 MB

2018

34

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Eye-Diagram Estimation Methods for Voltage-and Probability-Dependent PAM-4 Signal on Stacked Through-Silicon Vias (TSVs)

Park, Junyong, Kim, Jonghoon J., Choi, Sumin, Kim, Youngwoo, Kim, Heegon, Kim, Joungho

Year:

2017

Language:

english

File:

PDF, 5.07 MB

english, 2017

35

Depth-Based Detection of Standing-Pigs in Moving Noise Environments

Kim, Jinseong, Chung, Yeonwoo, Choi, Younchang, Sa, Jaewon, Kim, Heegon, Chung, Yongwha, Park, Daihee, Kim, Hakjae

Journal:

Year:

2017

Language:

english

File:

PDF, 9.44 MB

english, 2017

36

Liposomal borrelidin for treatment of metastatic breast cancer

Jeong, Moonkyoung, Kim, Heegon, Kim, Sunghoon, Park, Ji-Ho

Journal:

Drug Delivery and Translational Research

Year:

2018

Language:

english

File:

PDF, 2.07 MB

english, 2018

37

Real-time processing for intelligent-surveillance applications

Lee, Sungju, Kim, Heegon, Sa, Jaewon, Park, Byungkwan, Chung, Yongwha

Journal:

IEICE Electronics Express

Year:

2017

Language:

english

File:

PDF, 4.04 MB

english, 2017

38

Intratumoral depletion of regulatory T cells using CD25-targeted photodynamic therapy in a mouse melanoma model induces antitumoral immune responses

Oh, Dong Sun, Kim, Heegon, Oh, Ji Eun, Jung, Hi Eun, Lee, Yun Soo, Park, Ji-Ho, Lee, Heung Kyu

Journal:

Year:

2017

Language:

english

File:

PDF, 8.12 MB

english, 2017

39

Antitumor Efficacy of Focused Ultrasound-MFL Nanoparticles Combination Therapy in Mouse Breast Cancer Xenografts

Kim, Daehyun, Han, Junhee, Park, So Yeon, Kim, Heegon, Park, Ji-Ho, Lee, Hak Jong

Journal:

Year:

2020

File:

PDF, 2.25 MB

2020

40

Management of lymph node metastasis via local chemotherapy can prevent distant metastasis and improve survival in mice

Kim, Heegon, Han, Hyeonjeong, Jeong, Moonkyoung, Han, Junhee, Park, Ji-Ho

Journal:

Journal of Controlled Release

Year:

2020

File:

PDF, 670 KB

2020